龙芯 Godson-3B and Godson-3c

at ISSCC 2011, Hu, Weiwu described Godson-3B: 8-core , 65nm CMOS LP/GP mixed process with 7layers of Cu metallization. It contains 582.6M transistors in 299.8mm2 area.

The highest frequency is 1.05Ghz and peak performances is 128/256GFLOPS DP/SP with 40W power consumption. Godson-3B is based on a 64-bit MIPS core with 200 instructions added for x86 compatibility and integrates 256-bit SIMD(Single-instruction, multiple-data) vector processing unit including eight 64-bit MAC(Multiply-accumulate)s.

Godson-C will be 16-core target 512GFlops@2Ghz in 28 nm, two years away.

Hu’s presentation at ISSCC 2010

This link same presentation by hu

Key Observations:

Godson-3 support HT , so it can use AMD support chipset to support PCI-E etc

Godson-3 support DDR3 all off the self components

Godson-3B/C is some kind of fusion core that use MIPS64 and x86 support and Vector Processor to replace the old FP to boost FLOPS

this link give some more info and this early link

Good GODSON roadmap

1u2T godson-3B (loongson-3B) 16 socket@2Tflops

some other info on godson-3A(loongson-3A) server

LS3-CCNUMA-DEV is one solution for double chips server application. The board based on two 3A processors and AMD RS780E+SB710 chipsets

About laotsao 老曹

HopBit GridComputing LLC Rockscluster Gridengine Solaris Zone, Solaris Cluster, OVM SPARC/Ldom Exadata, SPARC SuperCluster
This entry was posted in HPTC. Bookmark the permalink.

Leave a Reply

Fill in your details below or click an icon to log in:

WordPress.com Logo

You are commenting using your WordPress.com account. Log Out / Change )

Twitter picture

You are commenting using your Twitter account. Log Out / Change )

Facebook photo

You are commenting using your Facebook account. Log Out / Change )

Google+ photo

You are commenting using your Google+ account. Log Out / Change )

Connecting to %s