at ISSCC 2011, Hu, Weiwu described Godson-3B: 8-core , 65nm CMOS LP/GP mixed process with 7layers of Cu metallization. It contains 582.6M transistors in 299.8mm2 area.
The highest frequency is 1.05Ghz and peak performances is 128/256GFLOPS DP/SP with 40W power consumption. Godson-3B is based on a 64-bit MIPS core with 200 instructions added for x86 compatibility and integrates 256-bit SIMD(Single-instruction, multiple-data) vector processing unit including eight 64-bit MAC(Multiply-accumulate)s.
Godson-C will be 16-core target 512GFlops@2Ghz in 28 nm, two years away.
Godson-3 support HT , so it can use AMD support chipset to support PCI-E etc
Godson-3 support DDR3 all off the self components
Godson-3B/C is some kind of fusion core that use MIPS64 and x86 support and Vector Processor to replace the old FP to boost FLOPS
Good GODSON roadmap
1u2T godson-3B (loongson-3B) 16 socket@2Tflops
LS3-CCNUMA-DEV is one solution for double chips server application. The board based on two 3A processors and AMD RS780E+SB710 chipsets